kit de réparation CTC

kit de réparation CTC

Le kit de réparation CTC est le plus complet et le plus polyvalent que vous ne puissiez trouver. Il contient tous les outils et accessoires nécessaires à la réparation de circuits imprimés endommagés.

Applications

Réparation des coins cassés, application de solder mask, remplacement des pistes et des pastilles pour CMS et BGA ,réparation des trous métallisés,  remplacement des contacts dorés.

 

La mallette comprend tous les accessoires de qualité, est très économique, et vous permet de sauver des circuits jusqu'ici condamnés.

 

2012100layoutlarge1.jpg

201-2102 Professional Repair Kit 230V

 

 

2012100kit1.jpg

 

Damaged Base Material


  

Damaged Base Material

 



Figure 1: Scrape away damaged base board material with a knife.


Figure 2: Micro-Drill System.


Figure 3: An undercut, to enhance mechanical strength, may be desired for class 3 product.


Figure 4: Apply the epoxy with a mixing stick sharpened at the end.

Figure 5: For large areas, apply the epoxy with a foam swab to create a texture.

 

Damaged Base Material

 

  

Damaged Base Material

 


  
Figure 1: Cut away damaged base material with the Saw or milling cutter.

  
Figure 2: Cut a groove into the edge of the circuit board.

  
Figure 3: Mill a tongue onto the edge of the replacement base material.

  
Figure 4: Check fit of new base material. The tongue must mate with the groove in circuit board.


Figure 5: Micro-Drill System.

 

Damaged Plated Hole


  

Damaged Plated Hole

 


  
Figure 1: Drill out the hole using a Micro-Drill System and ball mill.

  
Figure 2: The eyelet flange can be used to secure a new circuit in place.

  
Figure 3: Set the eyelet using an Eyelet Press.

  
Figure 4: Completed repair.

 

 

Damaged Surface Mount Pad


  

Damaged Surface Mount Pad

 

 


  
Figure 1: Remove the defective pad and remove soldermask from the connecting circuit

  
Figure 2: Select a replacement pad that matches the missing pad.

  
Figure 3: Scrape off the adhesive bonding film from the solder joint area on the back of new pad.

  
Figure 4: Cut out the new surface mount pad. Cut from the plated side.

  
Figure 5: Place the new surface mount pad in place using Kapton tape

  
Figure 6: Bond the new pad using a Bonding System.

  
Figure 7: Completed repair.

 

Delamination


  

Delamination

 


  
Figure 1: Drill into the delamination blister using a ball mill and a Micro-Drill.

  
Figure 2: Inject epoxy into the delamination blister.

  
Figure 3: Completed repair.


Figure 4: Micro-Drill System.

 

Damaged Key Slot


  

Damaged Key Slot



  
Figure 1: Mill away the damaged board base material using a Micro-Drill System and ball mill.


Figure 2: Apply epoxy to the edges of the key slot using a mixing stick sharpened at the end.


Figure 3: Completed key slot repair.


Figure 4: Micro-Drill System.

 

Contenu du Kit:

Part No.

Qty

Description

115-6002

1

Ball Mill, Carbide, #2, .039" Diameter

115-6003

1

Ball Mill, Carbide, #3, .047" Diameter

115-6004

1

Ball Mill, Carbide, #4, .055" Diameter

115-6005

1

Ball Mill, Carbide, #5, .063" Diameter

115-6006

1

Ball Mill, Carbide, #6, .071" Diameter

115-6007

1

Ball Mill, Carbide, #7, .083" Diameter

115-6050

1

Ball Mill, Carbide, #1/2, .027" Diameter

115-3962

2

Base Board Transplant, FR4, .062" Thk.

115-3993

2

Base Board Transplant, FR4, .093" Thk.

115-2706

1

Bonding Film, 1.50" x 2.25"

115-3102

1

Bonding Iron, 120 VAC

115-2104

1

Bonding Tip, Tapered

115-2202

1

Bonding Tip, .060" Diameter

115-2205

1

Bonding Tip, .035" Diameter

115-2210

1

Bonding Tip, .120" Diameter

115-2304

1

Bonding Tip, .025" x .080"

115-2306

1

Bonding Tip, .040" x .060"

115-2318

1

Bonding Tip, .080" x .500"

CS025035AS

1

Circuit Frame, BGA Pads .025"/.035"

CC050060AG

1

Circuit Frame, Contacts .050"/.060"

CC070080AG

1

Circuit Frame, Contacts .070"/.080"

CP050060AS

1

Circuit Frame, PTH Pads .050"/.060"

CP070080AS

1

Circuit Frame, PTH Pads .070"/.080"

CP090100AS

1

Circuit Frame, PTH Pads .090"/.100"

CVAR0001AS

1

Circuit Frame, SMP Variety

CFV003AS

1

Circuit Frame, Variety

115-5206

1

Circuit Track, .002" x .006"

115-5210

1

Circuit Track, .002" x .010"

115-5315

1

Circuit Track, .003" x .015"

115-5530

1

Circuit Track, .005" x .030"

115-9348

1

Color Agent, PMS 348

115-9358

1

Color Agent, PMS 358

115-3302

4

Epoxy

115-3310

1

Eraser

115-7306

50

Eyelet, Flat Flange .030" ID x .093" LUF

115-7336

50

Eyelet, Flat Flange .033" ID x .093" LUF

115-7366

50

Eyelet, Flat Flange .036" ID x .092" LUF

115-7456

50

Eyelet, Flat Flange .045" ID x .093" LUF

115-3132

1

File

235-2102

4

Foam Swab

355-2102

1

Knife

115-3138

1

Mill Handle

115-3314

4

Mixing Stick

115-3312

4

Plastic Cup

115-3360

4

Plastic Probe

115-3108

1

Circuit Board

115-3362

1

Rod, FR4, .093" Diameter

115-3364

1

Rod, FR4, .125" Diameter

115-3366

1

Rod, FR4, .187" Diameter

355-4235

1

Saw Blade

115-3120

2

Setting Tool

115-3902

3

Syringe Assembly

115-3122

1

Tool Base

115-3134

1

Tool Handle

310-2100

1

Tape Dots, Variety Pack 

950-4508

1

Tape, Kapton

115-3142

1

Tip Tool

335-5183

1

Tweezer

115-3103

1

* Bonding Iron, 230 VAC (201-2102 Kit)

 

 

 

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